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Press Release Plano, Texas (July 21, 2003) MicroFab Technologies today announced the award of a SBIR program titled, “Flip-Chip: Ink Jet Printed UBM & Lead Free Solder”. The program’s objective is develop an environmentally friendly, low cost, fine pitch and high reliability flip chip interconnect for the electronic industry. The MicroFab team, under the leadership of the principal investigator, Dr. Donald Hayes, will develop a no lead, flip chip metal stack onto a silicon device that has copper input/output pads. The manufacturing technology innovations of this proposal have the potential to deliver the electronic industry a method to produce a flip chip interconnect with the fewest number of process steps, require the least capital investment, minimize exposure to hazardous material and yet produce a highly reliable product. MicroFab will commercialize the under bump metal printing technology by providing prototype services, licensing and/or through the sale of manufacturing systems to corporations that prefer internal capability.
About the Company Based in Plano, Texas, MicroFab Technologies has pioneered digital microdispensing technologies for the past 18 years. MicroFab’s mission is to be the leading global supplier of printing platforms, devices, and services that enable high-payoff applications for microdispensing and precision printing in a wide range of industries. Commercial applications of the technology include microdispensing of electrical and optical polymers, bioactive materials (Proteins, DNA, Reagents), solder, adhesives, and nanoparticle laden fluids. MicroFab Technologies is at www.microfab.com. Contact Dr. David B. Wallace, Vice-President, Technology Development, at info@microfab.com or by phone at 972-578-8076 (ext. 12).
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