Solder Bumping Services & Technology
MicroFab has developed patented, ink-jet based printing processes for fabrication of high-density microelectronic and optoelectronic packages. Picoliter volumes of solder (as small as 25µm in diameter) are dispensed at temperatures up to 250°C. The data-driven nature of the processes leads to a high level of process integration, lower cost, and increased flexibility. Potential applications include: integrated circuit packaging, chip scale packaging, optoelectronic interconnects, disk drive assemblies, and printed circuit board manufacturing. Solder can be placed onto pads at rates of over 400 bumps per sec. Solder interconnects and vertical vias can also be printed.
Solder Jet® technology is available through MicroFab’s in-house bumping services, on MicroFab’s integrated ink-jet printing platforms, the jetlab® family, and as a subsystem for integration into custom platforms.
In addition to tin-lead, a lead-free Solder Jet® process now available.
A brief movie describing the Solder Jet® process can be viewed by clicking here.
Contact MicroFab for more information.
